Failure-Free Integrated Circuit Packages

Failure-Free Integrated Circuit Packages

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    Spot, stop, and analyze IC device failure with this unique illustrated guide. Worth more than a thousand words, each illustration in "Failure- Free Integrated Circuit Packages" gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. "Failure-Free Integrated Circuit Packages" helps you: find, identify, and correct potential failures before they occur; improve device reliability; learn from case studies of IC package failure modes; quickly locate failures through visual comparisons; apply state-of-the-art failure analysis techniques; comprehend the physics behind the failure mechanism; and, understand the limitations of reliability testing and lifetime estimation.Inside, you'll find a practical and easy way to approach failure analysis of IC's in organic packages. Areas covered include: fundamentals of IC package technologies; reliability; physics and chemistry of failures in packaged devices; strategies for locating failures; failure analysis techniques; failure modes common in organic IC packages; and, emerging assembly materials for IC packaging.

      Author

      Charles Cohn

      Author

      Charles Harper

      Binding

      Hardcover

      EAN

      9780071434843

      ISBN

      0071434844

      Label

      McGraw-Hill Professional

      Manufacturer

      McGraw-Hill Professional

      NumberOfPages

      288

      ProductGroup

      Book

      ProductTypeName

      ABIS_BOOK

      PublicationDate

      2004-07-01

      Publisher

      McGraw-Hill Professional

      Studio

      McGraw-Hill Professional

      UPC

      639785508564

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