Ball Grid Array Technology

Ball Grid Array Technology

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This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.

    Author

    John H. Lau

    Binding

    Hardcover

    EAN

    9780070366084

    ISBN

    007036608X

    Label

    McGraw-Hill Professional

    Manufacturer

    McGraw-Hill Professional

    NumberOfPages

    635

    ProductGroup

    Book

    ProductTypeName

    ABIS_BOOK

    PublicationDate

    1994-11-01

    Publisher

    McGraw-Hill Professional

    Studio

    McGraw-Hill Professional

    Ball Grid Array Technology

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